Ever increasing demand for short lead-time and high component-density challenges current pallet-supply approaches:
- PCB-based pallet-design starts after receiving an assembled PCB, which is highly wasteful lead-time-wise.
- PCB-less pallet-design (e.g. using tallest-SMT) compromise pallet performance, thus precluding wave-soldering of high-density PCBs.
Suron's AutoPallet software permits for both PCB-less and high-end pallet-design:
- Pallet design may start as soon as PCB-design ends
- Pallet design handles THP-SMT distances below 0.05 inch
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